Gaya APA
Nogita, Kazuhiro, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri. (2018).
Electronic Packaging Interconnect Technology .
Zurich:
Trans Tech Publications Ltd.
Gaya Chicago
Nogita, Kazuhiro, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri.
Electronic Packaging Interconnect Technology.
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.
Gaya MLA
Nogita, Kazuhiro, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri.
Electronic Packaging Interconnect Technology.
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.
Gaya Turabian
Nogita, Kazuhiro, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri.
Electronic Packaging Interconnect Technology.
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.