Gaya APA
Nogita, K. et al (2018).
Electronic Packaging Interconnect Technology .
Zurich:
Trans Tech Publications Ltd.
Gaya Chicago
Nogita, K. et al.
Electronic Packaging Interconnect Technology.
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.
Gaya MLA
Nogita, Kazuhiro. et al.
"Electronic Packaging Interconnect Technology".
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.
Gaya Turabian
Nogita, Kazuhiro. et al..
Electronic Packaging Interconnect Technology.
Zurich:
Trans Tech Publications Ltd,
2018.
Electronic Resource.